Stabilization Suspensions And Methods Of Manufacture

ABSTRACT

A suspension assembly is described. A suspension assembly including a support member configured to receive at least a first circuit member. The first circuit member including at least a trace. The first circuit member disposed on the support member.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/932,624 filed on Jul. 17, 2020, which claims the benefit of U.S.Provisional Application No. 62/888,324 filed on Aug. 16, 2019, both ofwhich are hereby incorporated by reference in their entireties.

FIELD

The invention relates generally to stabilization suspensions used inconnection with cameras, including those incorporated into mobiledevices such as phones and tablets.

BACKGROUND

Various suspension assemblies use shape memory alloy (“SMA”) wires tocouple a support member of a suspension assembly to a moving member ofthe suspension assembly. Suspension assemblies of these types can beincluded in cameras as part of a camera lens element, which canoptionally include an auto-focusing drive. The systems may be enclosedby a structure such as a screening can. Such suspension assemblies canbe actuated by applying electrical drive signals to the SMA wires.

There remains a continuing need for improved lens suspensions. Inparticular, there is a need for such suspension structures with improvedstructures for coupling electrical signals on the suspensions that donot damage the SMA wires and/or are less susceptible to the SMA wiresbeing damaged when the suspensions are in use. Suspension structures ofthese types that are highly functional, robust and efficient tomanufacture would be particularly desirable.

SUMMARY

A suspension assembly is described. A suspension assembly is described.A suspension assembly including a support member configured to receiveat least a first circuit member. The first circuit member including atleast a trace. The first circuit member disposed on the support member.

Other features and advantages of embodiments of the present inventionwill be apparent from the accompanying drawings and from the detaileddescription that follows.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are illustrated by way of exampleand not limitation in the figures of the accompanying drawings, in whichlike references indicate similar elements and in which:

FIG. 1 illustrates a suspension assembly that includes a support memberand a moving member 14 according to an embodiment;

FIG. 2 illustrates a cross-section of the suspension assembly asillustrated in FIG. 1 taken along line A;

FIG. 3 illustrates an exploded view of the suspension assemblyillustrated in FIG. 1 ;

FIG. 4 illustrates a moving member of a suspension assembly including ashim style bearing limiter as illustrated in FIG. 1 ;

FIG. 5 illustrates a suspension assembly according to an embodimentincluding an O-shaped single circuit;

FIG. 6 illustrates a suspension assembly according to an embodimentincluding an L-shaped single circuit;

FIG. 7 illustrates a suspension assembly including two trace membersaccording to an embodiment;

FIG. 8 illustrates an exploded view of a moving member 401 including acircuit member according to various embodiments;

FIG. 9 illustrates an exploded view of a moving member including acircuit member according to various embodiments;

FIG. 10 illustrates an exploded view of a static member including acircuit member 306 according to various embodiments;

FIG. 11 illustrates a circuit member in a shape relatively resembling aC-shape according to an embodiment;

FIG. 12 illustrates an arrangement of circuit members in a shaperelatively resembling a C-shape according to an embodiment;

FIG. 13 illustrates a circuit member in a shape relatively resembling aC-shape according to an embodiment;

FIG. 14 illustrates a circuit member, according to an embodiment;

FIG. 15 illustrates circuit members of different shapes, according toembodiments;

FIG. 16 illustrates an arrangement of circuit members in a shaperelatively resembling a C-shape according to an embodiment;

FIG. 17 illustrates an arrangement of circuit members in a shaperelatively resembling an L-shape according to an embodiment;

FIG. 18 illustrates circuit members in a shape relatively resembling anL-shape configured to be electrically coupled according to anembodiment;

FIG. 19 illustrates an arrangement of circuit members in a shaperelatively resembling an L-shape according to an embodiment;

FIG. 20 illustrates an arrangement of circuit members in a shaperelatively resembling an L-shape according to an embodiment;

FIG. 21 illustrates a moving member including multiple pieces accordingto an embodiment;

FIG. 22 illustrates various embodiments of moving members and staticmembers including multiple pieces according to an embodiment;

FIG. 23 illustrates multiple vies of a moving sensor circuit assemblyformed of multiple members according to an embodiment; and

FIG. 24 illustrates flexible circuits for a moving sensor circuitaccording to embodiments.

DETAILED DESCRIPTION

Embodiments include optical image stabilization (“OIS”) suspensionshaving a support member, a moving member, and one or more shape memoryalloy (“SMA”) elements or wires extending between the support member andthe moving member. Lens components such as a lens holder and optionallyan auto focus (AF) assembly are fixedly mounted to or with respect tothe static plate. The SMA wires can be driven by a controller to movethe moving plate and image sensor thereon about x-y axes with respect tothe static plate and lens components, and stabilize the position of thelens components and the image produced thereby on the sensor. The OISsuspension can thereby compensate for vibrations such as those thatmight be caused by movement of the user's hands. Suspensions of thesetypes can be miniaturized, and used, for example, with camera lens andimaging systems incorporated into mobile phones, tablets and otherdevices.

FIG. 1 illustrates a suspension assembly 10 that includes a flexibleprinted circuit (“FPC”) or support member 12 and a spring crimp circuitor moving member 14 that is coupled to the support member 12. Thesupport member 12 is disposed over an optional base 16. Shape memoryalloy (“SMA”) wires 15 a-d extend between the support member 12 and themoving member 14, and can be electrically actuated to move and controlthe position of the moving member with respect to the support member 12.Each of the SMA wires 15 a-d are attached to the support member 12 usingsupport member crimps 28 a-d and to the moving member using movingmember crimps 26 a-d. According to other embodiments, the crimps orother SMA wire attach structures are organized in other arrangements,such as a single wire attach structures rather than in pairs. Thesuspension assembly 10 also includes a shim style bearing limiter 18.The bearing limiter is configured to minimize the amount of bearingcompression so that the bearing does not become permanently deformed.The shim style bearing limiter 18 is configured to sit between thesupport member 12 and the moving member 14. According to variousembodiments, a lens can be mounted to the moving member 14. According toother embodiments, an autofocus system supporting the lens can bemounted to the moving member 14. According to various embodiments, thesuspension assembly 10 is a camera lens optical image stabilization(“OIS”) device that can be incorporated, for example, into mobilephones, tablets, laptop computers and other electronic devices.

FIG. 2 illustrates a cross-section of the suspension assembly asillustrated in FIG. 1 taken along line A. The shim style bearing limiter18 is positioned between the moving member 14 and the support member 12.The shim style bearing limiter 18 is configured to minimize the amount abearing 20 can be compressed by the moving member 14 before the movingmember 14 hits the shim style bearing 18. The height of the bearing 20defines a bearing distance about a z-axis of the suspension assembly.For some embodiments, a gap 22 (also referred to herein as gap distance)can exist between the moving member 14 and the shim style bearinglimiter 18. The gap 22 can enable the moving member 14 to move in thedirection of the longitudinal axis, for example in the direction of an xaxis and y axis, of the moving member 14. For various embodiments, thegap 22 is configured to be no more than 20 percent of the originalheight of a bearing 20. For some embodiments, the gap 22 can be in arange including 20-25 microns. The thickness of the shim style bearinglimiter 18, according to some embodiments, is configured to allow abearing 20 to protrude over the shim style bearing limiter by a heightin a range of approximately 10-35 microns above the shim style bearinglimiter 18 when disposed on the support member 12.

The support member 12, for some embodiments, includes a dielectric layer24 disposed over at least a portion of the support member 12. Thedielectric layer 24 b can be a cover coat disposed over a conductivelayer 30. For various embodiments, the dielectric layer 24 is apolyimide layer. The conductive layer 30 includes one or more traces andis disposed over the support member 12. The support member 12, accordingto some embodiments, includes a partial etch pocket 32. The partial etchpocket 32 is configured to a location on a support member 12 for thebearing 20. The depth of the partial etch pocket 32 can be adjusted toprovide a desired gap 22 while reducing the thickness of a bearinglimiter, such as a shim style bearing limiter 18. In some cases,adjusting the depth of the partial etch pocket 32 can be more costeffective and/or convenient than increasing or decreasing materialthickness of a bearing limiter. Other embodiments include a supportmember without a partial etch pocket 32 formed in the support member 12.Such embodiments may include a thicker shim style bearing limiter 18instead.

Both the base member 12 and the moving member 14 are integrated leadstructures according to some embodiments, in that they have electricalstructures such as leads, contact pads and terminals (e.g., in a copper“Cu” or copper alloy layer) formed on a metal base layer 36 a,b (e.g.stainless steel (SST)). The dielectric layers 24 a,b separates theportions of the electrical structures that are to be electricallyisolated from the metal base layers 36 a,b (for various embodiments,other portions of the Cu layer are connected to or directly on a metalbase layer 36 a,b).

FIG. 3 illustrates an exploded view of the suspension assemblyillustrated in FIG. 1 . The shim style bearing limiter 18 is between thesupport member 12 and the moving member 14. As shown, the moving member14 includes a plate 60 and spring or flexure arms 62 a,b extending fromthe plate 60. The plate 60, for some embodiments, includes a sensormounting region configured to receive an image sensor. According tovarious embodiments, the plate 60 and flexure arms 62 a,b are formed ina spring metal base layer such as stainless steel. Moving member 14 isconfigured differently in other embodiments. For example, in otherembodiments, the flexure arms 62 a,b can be shaped differently, bedifferent in number, organized differently, and/or can extend from otherlocations on the plate 60.

The end portions of the flexure arms 62 a,b have mount regions 74 a,bthat are configured to be mounted to the mount regions 33 and 35 of thesupport member 12. Conductive traces 76 a,b on the base layer 36 a ofthe moving member 14 extend on the flexure arms 62 a,b. According tovarious embodiments, the traces 76 a,b also extend on the base layer 36a over portions of the plate 60. According to the illustratedembodiment, the traces 76 a,b on the arms 72 also extend to contact padson the plate 60. A layer of dielectric is located between the conductivetraces 76 s,b and the base layer 36 a,b to electrically insulate thetraces 76 a,b from the base layer 36 a,b.

The mount regions 74 a,b of the moving member flexure arms 62 a,b aremechanically attached to the mount regions 33 and 35 respectively of thesupport member 12. The traces 76 a,b on the flexure arms 62 a,b areelectrically connected to the associated traces on the support member12. According to various embodiments, the mechanical connections aremade by welds. The welds also enable electrical connections between themoving member 14 and the support member 12 that can be used to actuatethe moving member 14 using SMA wires 15 a-c. Other embodiments haveother structures for mechanically mounting the flexure arms 62 a,b tothe support member 12, and/or for electrically connecting the traces 76a,b on the flexure arms to the associated traces on the support member12.

The support member 12 and moving member 14 can be formed from additiveand/or subtractive processes using techniques including those known inthe art. Base layers 36 a,b are stainless steel according to variousembodiments. For other embodiments the base layers 36 a,b are othermetals or materials such as phosphor-bronze. Electrical structures,including, but not limited to, traces, terminals, and contact pads canbe formed from copper, copper alloys or other conductive materials.Polyimide or other insulating materials can be used as a dielectric.

FIG. 4 illustrates a moving member of a suspension assembly including ashim style bearing limiter as illustrated in FIG. 1 . The shim stylebearing limiter 18 is disposed on the support member 12, which isdisposed on base 16. The shim style bearing limiter 18 forms voids 40a-d. The voids 40 a-d are formed so that bearings 20 a-c are within thevoids 40 a-d. As illustrated, the support member 12, according to someembodiments, also includes three bearings 20 a-c formed as slidebearings. However, any number of bearings 20 a-c may be used. Thebearings 20 a-c formed as slide bearings can be made from or include alow friction material to enable relative sliding between the movingmember 14 and the support member 12. For some embodiments, the bearings20 a-c are ball bearings with features formed on support member 12 tocontain the ball bearings. The shim style bearing limiter 18, accordingto various embodiments, is configured to not be too high and rub on themoving member 14. Other embodiments, include a shim style bearinglimiter that is formed of separate sections instead of a unitary form.Each shim style bearing limiter section is configured to mount on thesupport member 12 adjacent to each of the one or more bearings 20 a-c.

FIG. 5 illustrates a suspension assembly according to an embodiment. Thesuspension assembly includes an O-shaped single circuit 102 formed usingtechniques including those described herein. Thus, all traces andconductive features needed for the circuit are formed on one member ofthe suspension assembly, such as the moving member 104. This reduces thenumber of steps in the manufacturing process, which reduces cost andreduces the manufacturing time.

The O-shaped single circuit 102 electrically couples electricalstructures on the moving member 104. For some embodiments, the movingmember 104 includes electrical structures including, but not limited to,contact pads for autofocus circuit connections 106 and circuit tailconnections 108. Circuit tail connections 108, according to someembodiments, are configured to connect an optical image stabilizercircuits and autofocus circuits to a circuit board or other circuitsexternal to the suspension assembly. The circuit tail connections 108are connected to a respective flexure arm 116, such as those describedherein, of the moving member 104 using techniques including thosedescribed herein. The circuit tail connections 108 are configured to befixed to a support member 112 using techniques, including, but notlimited to, a weld, adhesive, and, solder. The flexible arms 118 includeone or more traces on each flexible arm 118. The one or more trace iselectronically coupled to the O-shaped single circuit 102. The movingmember 104 includes SMA wire attach structures, such as those describedherein, configured as crimps 110 are electrically coupled to theO-shaped single circuit 102, according to some embodiments.

The suspension assembly also includes a support member 112. The supportmember 112 is configured to receive the moving member 104. The supportmember 112 includes one or more bearings 114, such as those describeherein, configured to be disposed between the moving member 104 and thesupport member 112. The support member 112 includes SMA wire attachstructures, such as those described herein, configured as crimps 118.The support member crimps 118, according to some embodiments, areconfigured to be electrically coupled with a common voltage or a groundvoltage. Each SMA wire 120 is attached to a support member 112 by asupport member crimp 110 at a first end of each SMA wire 120 and to themoving member by a moving member crimp 118 at a second end of each SMAwire 120, using techniques including those described herein. For someembodiments, the support member crimp 110 and the moving member crimpsare gold plated.

FIG. 6 illustrates a suspension assembly according to an embodiment. Thesuspension assembly includes an L-shaped single circuit 201 formed usingtechniques including those described herein. Thus, all traces andconductive features for the circuit are formed on a portion of a memberof the suspension assembly. Alternatively, all the traces are formed onone member of the suspension assembly, such as the moving member. Thisreduces the number of steps in the manufacturing process, which reducescost and reduces the manufacturing time. According to variousembodiments, all traces and conductive features are formed on a circuitmember 202 of the suspension assembly separate from the moving member204 and the static/support member 212. According to some embodiments,the circuit member 202 is formed to relatively resemble an L-shape.However, the circuit member 202 may be formed in other shapes. Theseother shapes, such as an L-shaped circuit member, reduce the area neededto form the circuit member 202 when to compared to an O-shaped circuitmember. This reduces the cost of manufacturing because the smaller areasprovide a higher density of components to be manufactured at a time.

The L-shaped single circuit 201 electrically couples electricalstructures on the circuit member 202. For some embodiments, the circuitmember 202 includes electrical structures including, but not limited to,contact pads for autofocus circuit connections 206 and a circuit tailconnection 208, such as those described herein. The circuit tailconnection 208 are connected to a respective flexure arm 216, such asthose described herein, using techniques including those describedherein. The circuit tail connection 208 is configured to be fixed to asupport member 212 using techniques including those described herein.The flexible arm 216 includes one or more traces on the flexible arm216. The one or more trace is electronically coupled to the L-shapedsingle circuit 201. The circuit member 202 includes SMA wire attachstructures, such as those described herein, configured as crimps 210electrically coupled to the L-shaped single circuit 201, according tosome embodiments.

The suspension assembly includes a spring chassis 215. According to someembodiments the spring chassis 215. The circuit member 202 is disposedon the static chassis 215. The circuit member 202, for some embodiments,is fixed to the spring chassis 215 using one or more of any of a weld,solder, adhesive, and other joining techniques. The spring chassis 215includes flexible arm members 218 that are configured as a movingmechanical spring. The flexible arm members 218, according to someembodiments, are formed integrally with the spring chassis 215, usingtechniques including those described herein. The flexible arm members218 are fixed to a support member 212 at an end portion of the flexiblearm members 218.

The support member 212 is configured to receive the moving member 204with the circuit member 202. The support member 212 includes one or morebearings 214, such as those describe herein, configured to be disposedbetween the moving member 204 and the support member 212. The supportmember 212 includes SMA wire attach structures, such as those describedherein, configured as crimps 220. The support member crimps 220,according to some embodiments, are configured to be electrically coupledwith a common voltage or a ground voltage. Each SMA wire 222 is attachedto a support member 212 by a support member crimp 220 at a first end ofeach SMA wire 222 and to the L-shaped single circuit 201 by the circuitcrimp 210 at a second end of each SMA wire 222, using techniquesincluding those described herein. For some embodiments, the supportmember crimps 220 and the circuit crimps 210 are gold plated.

FIG. 7 illustrates a suspension assembly including two trace membersaccording to an embodiment. A first circuit member 302 is disposed on amoving member 304 and a second circuit member 306 is disposed on astatic member 308. FIG. 8 illustrates an exploded view of a movingmember 401 including a circuit member 402 according to variousembodiments described herein. The circuit member 402, formed usingtechniques including those described herein, includes multiple traces404 and conductive features, including those described herein. Thecircuit member 402 is configured to be disposed on a portion of a movingmember chassis 406. The circuit member 402 includes a flexure arm 416formed integrally with the circuit member 402. The flexure arm 416includes a plurality of traces 404 b-d disposed and a plurality ofconductive features, such as contact pads 408, thereon.

The circuit member 402 includes all the traces and conductive featuresfor the moving member 401 and is configured to be disposed on a portionof the moving member chassis 406, according to some embodiments.According to some embodiments, the circuit member 402 is fixed to themoving chassis using one or more of any of a weld, solder, adhesive, andother joining techniques. The moving member chassis 406 includes one ormore flexible arm members 418. The flexible arm members 418, accordingto some embodiments, are formed integrally with the moving memberchassis 406, using techniques including those described herein. Themoving member chassis 406 includes SMA wire attach structures 412, suchas those described herein, configured to attach SMA wires usingtechniques including those described herein. For some embodiments, thecircuit member is formed to have a thickness less than the movingmember.

FIG. 9 illustrates an exploded view of a moving member 501 including acircuit member 502 according to various embodiments described herein.The circuit member 502, formed using techniques including thosedescribed herein, includes multiple traces 504 and conductive features,including those described herein. The circuit member 502 is configuredto be disposed on a portion of a moving member chassis 506. The circuitmember 502 includes a flexure arm 516, such as those described herein,formed integrally with the circuit member 502. The circuit member 502including the flexure arm 516, according to some embodiments, is for usewith a moving member chassis 506 including a single flexure arm 518formed integrally with the moving member chassis 506. The circuit member502 including the flexure arm 516 includes a plurality of traces 504 a-fand a plurality of conductive features, such as contact pads 508, for amoving member and is configured to be disposed on a portion of themoving member chassis 506, according to some embodiments. For someembodiments, the circuit member 502 is formed to have the same or asimilar thickness as the moving member chassis 506.

The circuit member 502 includes all the traces 504 a-f and conductivefeatures for the moving member 501 and is configured to be disposed on aportion of the moving member chassis 506, according to some embodiments.According to some embodiments, the circuit member 502 is fixed to themoving chassis using one or more of any of a weld, solder, adhesive, andother joining techniques. The moving member chassis 506 includes SMAwire attach structures 512, such as those described herein, configuredto attach SMA wires using techniques including those described herein.For some embodiments, the circuit member 502 is formed to have athickness less than the moving member chassis 506.

FIG. 10 illustrates an exploded view of a static member including acircuit member 306 according to various embodiments describe herein. Thecircuit member 306 includes all the traces and conductive features for astatic member 308 and is configured to be disposed on a at least aportion of the static member 308.

FIG. 11 illustrates a circuit member in a shape relatively resembling aC-shape according to an embodiment. The circuit member 1102 isconfigured to include all the traces and conductive features, such asthose described herein, and configured to be disposed on a moving memberor a static member of a suspension assembly, such as those describedherein. FIG. 12 illustrates an arrangement of circuit members 1202 in ashape relatively resembling a C-shape according to an embodiment. Theshape of the circuit member 1202 provides manufacturing efficiencies toreduce the cost of manufacturing suspension assemblies. For example, thecircuit member 1202 is formed in a shape such as the C-shape circuitmembers that enable nesting of individual parts during the manufacturingprocess reducing the area needed to manufacture one part. Thus, morecircuit members are made per batch.

FIG. 13 illustrates a circuit member in a shape relatively resembling aC-shape according to an embodiment. The circuit member 1302, accordingto some embodiments, is configured to have three sections 1304. In theillustrated embodiment, a first section 1304 a includes a plurality oftraces 1306 and conductive features 1308, such as those describedherein. The conductive features 1308 a are contact pads configured tocouple with another member of a suspension assembly, such as a circuitmember including those described herein. For some embodiments, thecontact pads configured to couple with another member of a suspensionassembly are disposed on a first section 1304 a. A second section 1304b, which is between the first section 1304 a and a third section 1304 d.The second section 1304 b includes traces 1306 and conductive features1308 b. According to some embodiments, the third section 1304 d does notinclude any traces but includes a portion 1310 configured to receive abearing, such as those described herein. According to some embodiments,the sections 1304 may include none or one or more portions 1310configured to receive a bearing. FIG. 14 illustrates a circuit member1402, according to an embodiment, in a shape relatively resembling an Lshape disposed on an O-shaped static member 1404. The circuit member1402 is configured according to embodiments describe herein. TheO-shaped static member 1404 is configured according to embodimentsdescribed herein. For some embodiments the O-shaped static member 1404is configured to have a profile for attaching bearings using techniquesincluding those described herein.

FIG. 15 illustrates circuit members of different shapes, according toembodiments, to be disposed together on a moving member chassis. A firstcircuit member 1502 is configured in a shape that relatively resembles aC-shape and is configured to be disposed on portion of a moving member1504 including a first flexure arm member 1505. The first circuit member1502 includes a first flexure arm 1506. The first flexure 1506 isconfigured to be disposed on the first flexure arm member 1505 usingtechniques including those described herein. A second circuit member1508 is configured in a shape that relatively resembles an L-shape. Thesecond circuit member 1508 includes a second flexure arm 1510. Thesecond flexure arm 1510 is configured to be disposed on another portionof a moving member 1504 including a second flexure arm 1507 usingtechniques including those described herein. The first and secondcircuit members are configured to include one or more electricalstructures including, but not limited to, contact pads and one or moretraces, such as those described herein. The separate circuit membersenable the components to be manufactured in nested batched which enablemanufacturing efficiencies that help reduce the cost of manufacturingand help to increase manufacturing yields.

FIG. 16 illustrates an arrangement of circuit members in a shaperelatively resembling a C-shape according to an embodiment. The shape ofthe circuit member, such as those described herein, enablesmanufacturing efficiencies to reduce the cost of manufacturingsuspension assemblies. For example, the circuit member 1602 is formed ina shape such as the C-shape circuit members that enable nesting ofindividual parts during the manufacturing process reducing the areaneeded to manufacture one part. Thus, more circuit members 1602 are madeper batch.

FIG. 17 illustrates an arrangement of circuit members in a shaperelatively resembling an L-shape according to an embodiment. The shapeof the circuit member, such as those described herein, enablesmanufacturing efficiencies to reduce the cost of manufacturingsuspension assemblies. For example, the circuit member is formed in ashape such as the L-shape circuit members 1702 that enable nesting ofindividual parts during the manufacturing process reducing the areaneeded to manufacture one part. Thus, more circuit members are made perbatch.

FIG. 18 illustrates circuit members in a shape relatively resembling anL-shape configured to be electrically coupled according to anembodiment. A first circuit member 1802 is configured in a shape thatrelatively resembles a L-shape and configured to be disposed on portionof a moving member 1804 including a first flexure arm member 1805. Thefirst circuit member 1802 a includes a first flexure arm 1806. The firstflexure 1806 is configured to be disposed on the first flexure armmember 1805 using techniques including those described herein. A secondcircuit member 1802 b is configured in a shape that relatively resemblesan L-shape. The second circuit member 1802 b includes a second flexurearm 1810. The second flexure arm 1810 is configured to be disposed onanother portion of a moving member 1804 including a second flexure arm1807 using techniques including those described herein. The first andsecond circuit members 1802 are configured to include one or moreelectrical structures including, but not limited to, contact pads andone or more traces, such as those described herein. The shape of thecircuit member enables manufacturing efficiencies to reduce the cost ofmanufacturing suspension assemblies. For example, the circuit member isformed in a shape such as the L-shape circuit members 1802 that enablenesting of individual parts during the manufacturing process reducingthe area needed to manufacture one part. Thus, more circuit members aremade per batch. Further, one or more traces or electrical features ofthe L-shape circuit members are configured to be electrically coupledwith another circuit member, such as another L-shape circuit member, atone or more connectors 1812.

FIG. 19 illustrates an arrangement of circuit members 1900 in a shaperelatively resembling an L-shape including one or more traces orelectrical features of the L-shape circuit members are configured to beelectrically coupled with another circuit member, according to someembodiments, using techniques including those described herein. Theshape of the circuit member enables manufacturing efficiencies to reducethe cost of manufacturing suspension assemblies. For example, thecircuit member is formed in a shape such as the L-shape circuit membersthat enable nesting of individual parts during the manufacturing processreducing the area needed to manufacture one part. Thus, more circuitmembers are made per batch.

FIG. 20 illustrates an arrangement of circuit members 2002 in a shaperelatively resembling an L-shape including one or more traces orelectrical features of the L-shape circuit members are configured to beelectrically coupled with another circuit member, according to someembodiments, using techniques including those described herein. Theshape of the circuit member enables manufacturing efficiencies to reducethe cost of manufacturing suspension assemblies. For example, thecircuit member is formed in a shape such as the L-shape circuit membersthat enable nesting of individual parts during the manufacturing processreducing the area needed to manufacture one part. Thus, more circuitmembers are made per batch.

FIG. 21 illustrates a moving member including multiple pieces accordingto an embodiment. For various embodiments, each piece 2102 of the movingmember is manufactured independently from the others in a batch ofsimilar pieces using techniques including those described herein. Thisincreases the manufacturing efficiencies and reduces the cost ofmanufacturing. Some embodiments include more than two pieces. Theillustrated embodiment includes a first piece 2102 a and a second piece2102 b. For some embodiments, one or more pieces includes a flexure arm.In the illustrated embodiment, the first piece 2102 a includes a firstflexure arm 2106. A second piece 2102 b includes a second flexure arm2110. For some embodiments, one or more of the pieces 2102 areconfigured to include one or more electrical structures including, butnot limited to, contact pads and one or more traces, such as thosedescribed herein. As illustrated, the first piece 2102 b includes one ormore electrical structures including, but not limited to, contact padsand one or more traces, such as those described herein. The second piece2102 a does not include electrical structures. For some embodiments, theone or more pieces are configured to be disposed on a chassis, such asthose described herein.

FIG. 22 illustrates various embodiments of moving members and staticmembers including multiple pieces. For various embodiments, each pieceof the moving member is manufactured independently from the others in abatch of similar pieces using techniques including those describedherein. This increases the manufacturing efficiencies and reduces thecost of manufacturing.

FIG. 23 illustrates multiple vies of a moving sensor circuit assemblyformed of multiple members according to an embodiment. The moving sensorcircuit assembly 2302 is configured to have an image sensor 2304disposed on an interposer circuit 2308 and to be moved as part of an OISassembly. One or more flexible circuits 2306 are configured to includeone or more traces and/or one or more other electrical structures, suchas those described herein. The one or more traces are configured toelectrically couple an image sensor 2304 or other electrical circuit toan electrical circuit external to the interposer circuit, for example ona printed circuit board (PCB). For some embodiments the flexiblecircuits 2306 are affixed to the interposer circuit 2304 using one ormore of any of a weld, solder, adhesive, and other joining techniques.The flexible circuits 2306 are configured to have a low stiffness in atleast one portion to enable motion in at least one direction. Each pieceof the moving sensor circuit assembly 2302 is manufactured independentlyfrom the others in a batch of similar pieces using techniques includingthose described herein. This increases the manufacturing efficienciesand reduces the cost of manufacturing.

FIG. 24 illustrates flexible circuits for a moving sensor circuitaccording to embodiments described herein. The flexible circuits 2402are configured to be manufactured independently from the other membersof the moving sensor circuit assembly in a batch using techniquesincluding those described herein. The flexible circuits 2402 include oneor more traces and/or other electrical structures, such as thosedescribed herein, and are configured to interconnect one or morecircuits. The flexible circuits 2402 are configured to have lowstiffness in at least a portion of the flexible circuit 2402 to enablemoving in one or more directions. This increases the manufacturingefficiencies and reduces the cost of manufacturing.

Although the invention has been described with reference to differentembodiments, those of skill in the art will recognize that changes canbe made in form and detail without departing from the spirit and scopeof the invention. Features of the different illustrated embodiments canbe combined with one another. The specification and drawings are,accordingly, to be regarded in an illustrative rather than a restrictivesense.

What is claimed is:
 1. A moving sensor circuit assembly comprising: aninterposer circuit configured to receive a sensor and to move in one ormore directions; and one or more flexible circuits, wherein each of theone or more flexible circuits include: a first portion configured toconnect to the interposer circuit; a second portion configured toconnect to a printed circuit board (PCB); and one or more tracesconfigured to electrically couple the interposer circuit to the PCB. 2.The moving sensor circuit assembly of claim 1, wherein the sensorcomprises an image sensor, and wherein the interposer circuit isconfigured to move in an x-direction and a y-direction as part of anoptical image stabilization (OIS) apparatus.
 3. The moving sensorcircuit assembly of claim 1, further comprising: at least two flexiblecircuits disposed around the interposer circuit, wherein the at leasttwo circuits are separated from one another.
 4. The moving sensorcircuit assembly of claim 1, wherein the one or more flexible circuitsare affixed to the interposer circuit via any of a weld, a solder, or anadhesive.
 5. The moving sensor circuit assembly of claim 1, wherein thefirst portion of each flexible circuit is substantially perpendicular tothe second portion.
 6. The moving sensor circuit assembly of claim 1,wherein the first portion of each flexible circuit comprises a lowerstiffness than the second portion to allow for movement of theinterposer circuit in the at least one direction.
 7. The moving sensorcircuit assembly of claim 1, further comprising four flexible circuitsdisposed about the interposer circuit.
 8. The moving sensor circuitassembly of claim 1, wherein the first portion of each flexible circuitincludes an angle of around 90 degrees, wherein the first portion isconfigured to bend around a corner of the interposer circuit.
 9. Aflexible circuit comprising: a first portion configured to connect to aninterposer circuit that is part of a moving sensor circuit assembly; asecond portion configured to connect to a printed circuit board (PCB);and one or more traces disposed along the first portion and the secondportion and configured to electrically couple the interposer circuit tothe PCB.
 10. The flexible circuit of claim 9, wherein the first portionof the flexible circuit is substantially perpendicular to the secondportion.
 11. The flexible circuit of claim 9, wherein the first portionof the flexible circuit comprises a lower stiffness than the secondportion to allow for movement of the interposer circuit in the at leastone direction.
 12. The flexible circuit of claim 9, wherein the firstportion of the flexible circuit includes an angle of around 90 degrees,wherein the first portion is configured to bend around a corner of theinterposer circuit.
 13. A system comprising: an interposer circuitconfigured to move along an x-axis and/or a y-axis; an image sensorconfigured to be connected to the interposer circuit; a printed circuitboard (PCB); and a flexible circuit comprising: a first portionconfigured to connect to the interposer circuit; a second portionconfigured to connect to the PCB; and one or more traces disposed alongthe first portion and the second portion and configured to electricallycouple the interposer circuit to the PCB.
 14. The system of claim 13,wherein the sensor comprises an image sensor, and wherein the interposercircuit is part of an optical image stabilization (OIS) apparatus. 15.The system of claim 13, further comprising: at least two flexiblecircuits disposed around the interposer circuit, wherein the at leasttwo circuits are separated from one another.
 16. The system of claim 13,wherein flexible circuit is affixed to the interposer circuit via any ofa weld, a solder, or an adhesive.
 17. The system of claim 13, whereinthe first portion of the flexible circuit is substantially perpendicularto the second portion.
 18. The system of claim 13, wherein the firstportion of the flexible circuit comprises a lower stiffness than thesecond portion to allow for movement of the interposer circuit in the atleast one direction.
 19. The system of claim 13, further comprising fourflexible circuits disposed about the interposer circuit.
 20. The systemof claim 13, wherein the first portion of the flexible circuit includesan angle of around 90 degrees, wherein the first portion is configuredto bend around a corner of the interposer circuit.